AdmissionNotice

Intel India Recruitment 2023 for Thermal platform engineer Post in Bengaluru

Full Time JOB SECTOR: IT Sector JOB SECTOR: Technology Sector OWNERSHIP:-Private
  • Full Time
  • JOB SECTOR: IT Sector
  • JOB SECTOR: Technology Sector
  • OWNERSHIP:-Private
  • Bengaluru

Website IntelIndia Intel India

LAST DATE FOR APPLY: NOT DISCLOSED

Job Vacancy in Intel India

Application’s are Invited by Intel India , Today, we are using our resources, scale, and reach to help our customers take use of digital technology’s potential to the fullest. Inspire by Moore’s Law, we always strive to improve semiconductor design and production in order to meet the most pressing needs of our clients.

Interested and qualified applicants for the Thermal platform engineer Post in Bengaluru who fulfilling the criteria may submit or apply their application according to the prescribed format along with the details CV as per Norms. For any query or full details visit their official websites https://www.intel.in/

And If you are a fresher/experienced remember always a well-written application/resume would be of great value. Before you start to writing you application letter, at first know what the company is looking for and whether you are a right fit to the company culture or norms in the given below:

 

NAME OF THE POST:

Thermal platform engineer

LOCATION:

Bengaluru

QUALIFICATION & SKILLS:

The candidate must possess at least one of the following degrees plus the years of experience determined for each degree in the areas specified below
The candidate must possess a Bachelor’s Degree in Mechanical Engineering with 15+ years direct experience in Thermal/Mechanical Design or a Master’s Degree in Thermal and Fluid Sciences with 10+ years direct experience in Thermal/Mechanical Design.* The relevant experience mentioned above will be in these areas:
Thermal solution design at silicon/ package and platform level.

JOB DESCRIPTION:

Take part in the creation of platform thermal design solutions for various FPGA platform products, including pathfinding, design, and development. Feedback on lessons learned and chances for integrating thermal architecture into silicon.
In charge of creating and disseminating marketing materials for thermal solution design across various form factors and FPGA market segments.
Strong expertise in heat transfer and product knowledge to make quality decisions despite inadequate information. * Ability to collaborate with and influence cross domain teams, in particular the H/W board design and power teams, to meaningfully implement new ideas and solutions.
Identify technical risks and work together to drive any necessary solution adjustments for the benefit of the overall design. Develop alternate strategies to get around obstacles and spot and seize chances.

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To apply for this job please visit jobs.intel.com.

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